Pressure sensor bare dies on wafer level
Our piezo resistive pressure sensor dies are designed and specialized for a wide range of applications. Through 4 product lines the design, material and production process are optimized for their multiple target applications.
This ranges from high precision application with an excellent long-term stability, to highly robust application through cost efficient mobility application and strain gage dies.
IPD10 Series - High Precision Technology
High precision silicon pressure sense dies from 4kPa up to 40MPa for differential, gage and absolute pressure sensor applications with focus on best accuracy, best long-term stability and an option for high static pressure. The design allows flexible wire bonding options.
IPD25 Series - Strain Gage Dies
Silicon strain gage dies are suitable for multiple applications. Where ever it is required to measure a force, the strain gage dies can help. Two prominent examples are pressure sensors with the dies attached on a steel membrane for use with aggressive media or tension force measurements.
The dies are optimized for a wide temperature range up to +150°C and an additional surface protection layer protects the die against external impacts like humidity.
IPD35 Series - Mobility Technology
Silicon pressure sense dies optimized for mobility applications from 100kPa up to 5MPa for differential, gage and absolute pressure sensor applications with focus on good long-term stability, with increased TCR, wide temperature range up to +150°C and an additional surface protection layer against external impacts like humidity. The design allows flexible wire bonding options.
IPD40 Series - High Robust Technology
High robust silicon pressure sense dies from 10kPa up to 50MPa for differential, gage and absolute pressure sensor applications with focus on high accuracy, high long-term stability and an increased TCR allowing a temperature measurement and compensation through the sensor bridge itself. The design allows flexible wire bonding options.