About
Insenso GmbH
Custom Pressure Sensing Solutions
– Designed for Precision and Efficiency
At Insenso, we specialize in customized pressure sensing solutions tailored to the specific technical and commercial requirements of our clients. Leveraging standard platform architectures, our highly experienced team in sensor design and project management can rapidly develop bespoke solutions with proven performance and reliability.
As a full-cycle MEMS dies and pressure transmitters manufacturer, Insenso maintains complete control over the entire production process. This vertical integration allows for accelerated development cycles, cost-optimized designs, and consistently high quality in every product.
Production Facilities:
- Design & Development: Berlin, Germany
- Manufacturing: Europe & China
Our Core Competencies
We offer comprehensive R&D, production, and sales in the field of high-precision pressure sensing, including:
- Piezoresistive pressure sense dies
- Miniaturized pressure sensor modules
- Fully assembled pressure transmitters
top facts
Founded 2020 in Berlin, Germany
Own MEMS chip design
Full in-house production
High-precision pressure sensors
Custom industrial solutions worldwide
FULL VALUE CHAIN SUPPORT
Products
Customised Services
IPD
Sense die
Semiconductor
+ MEMS
• Own designs and technologies for Semiconductor and
MEMS core IP
• Lang experience in the industrial and mobility sector
IPM
Sensor Component
Chipon board
• Assembling and
packaging of dies
(die bonding. screen printing. soldering. gluing.
wirebonding …. )
• Material. design
and technology core IP
• lndustrial and Mobility sector
Customized Services
IPM/IPC
Sensor Module
Second Level Packaging
• Second level packaging (crimping. welding. soldering. electronics … )
• Calibration (IPC)
• Material. design and technology
IPT
Transmitter
Calibration
• Calibration
• Polishing. labelling
• Final tests
• Technology and software
• Qualification according to customer demand
Certification (CE)
Customised Services
IPM/IPC
Sensor Module
Second Level Packaging
• Second level packaging (crimping. welding. soldering. electronics … )
• Calibration (IPC)
• Material. design and technology
IPT
Transmitter
Calibration
• Calibration
• Polishing. labelling
• Final tests
• Technology and software
• Qualification according to customer demand Certification (CE)
Core Technology – Precision Engineering from Design to Final Test
At Insenso, we offer complete in-house capabilities covering every step of pressure sensor development – from semiconductor processing to final product qualification. Our vertically integrated approach guarantees superior quality, traceability, and tailored sensor solutions for demanding industrial and medical applications.
Semiconductor Process & MEMS Technology
Our production begins with advanced semiconductor and MEMS processes, including 3D microstructuring (wet and dry etching), anodic and silicon direct bonding, precision dicing, and optical inspection. We manufacture our own piezoresistive elements and integrate test structures during chip fabrication.
Sensor Packaging & Assembly
We utilize automated die bonding, wire bonding, and advanced sealing technologies such as glass soldering and annealing. Further steps include precision oil filling, membrane stamping, and CNC machining. Specialized welding methods (TIG, resistance, and laser) are applied for robust assembly.
Testing & Qualification
Every product undergoes a series of rigorous tests to ensure long-term reliability:
- Performance and stability testing
- Burst pressure and overpressure tests
- Pull and shear strength verification
- Helium leak detection
- Full qualification of piezoresistive components
Customization & Flexibility
Insenso provides a high degree of design flexibility – from adjustable sensitivity and custom form factors to customer-specific testing. Our team can adapt sensor modules to your unique technical requirements.
contact us
Contact
Insenso GmbH
Rudower Chaussee 29
12489 Berlin
Germany
tel: +49 (0) 176 16164900
mail: info@insenso.de